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High-Temperature Tape for Release Paper

I. Product Overview

High-temperature tape for release paper is a heat-resistant adhesive tape used in adhesive with release paper. It features both high-temperature resistance and low peel strength, and is used for temporary fixing and adhesive protection during release paper processing. It is suitable for release paper applications in high-temperature environments such as baking and electronics.

II. Key Features

  • High-temperature resistance: Withstands temperatures from -20℃ to 260℃, leaving no residual adhesive or aging under high temperatures.
  • Low viscosity and easy peeling: Peel strength with release paper ≤5g/25mm, peeling without residue and without damaging the substrate.
  • Stable adhesive: Uniform adhesive surface, solvent-resistant, suitable for release paper cutting, laminating and other processes.

III. Common Specifications

  • Width: 10-1000mm, length: 50-1000m (customizable).
  • Thickness: 0.05-0.2mm, substrate is PET film.
  • Temperature resistance level: Short-term temperature resistance up to 260℃, long-term temperature resistance up to 180℃.

IV. Typical Applications

High-temperature die-cutting positioning of release paper, fixing of release paper for baking, adhesive protection of release paper for electronic components.

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